Molded Components

CSP’s Activ-PolymerTM produces custom device components using patented technology. This method provides structure and protection simultaneously, enabling customers to realize increased product performance together with superior packaging design and cost efficiency.

CSP Technologies molded components

Molded components are used in a variety of applications, including drug delivery devices, point-of-care diagnostic devices, industrial sensors, and various electronics.

Tailored for specific applications, molded components made with Activ-PolymerTM technology solve complex product challenges in numerous settings.


  • Superior product protection
  • Minimize size by incorporating absorption capabilities into mechanical components
  • Reduce assembly complexity by reducing the number of components

Regulatory Compliance

The compositions of CSP’s Activ-PolymerTM technology are designed to comply with the U.S. Food and Drug Administration (FDA) and the European Union Guidelines for Food and Drug Contact.  Activ-PolymerTM technology formulations are described in our Master Drug File #14789.