CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines.

Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size.

CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.


Activ-BlisterTM solutions can be incorporated into a wide range of blister packaging formats, including:

  • Push-through blisters
  • Peel/push blisters
  • Cold-form foils
  • High barrier films
  • PVdC-coated or EVOH-laminated films
  • Aluminum-aluminum blisters
  • High barrier thermoform blisters


  • Heat-staking option to securely bind to foil without the use of adhesives; cost effective and eliminates residual solvents that can off-gas and interact with drug product
  • Oxygen-scavenging formulation does not require moisture to be active; effective in low RH
  • VOC-scavenging capability
  • Development services to optimize design and function
  • Implementation / validation support


  • Design flexibility – products typically stored in bottles, with desiccant sachets, can use thermoformed blister cards without sacrificing moisture protection
  • Reduced cost – achieve premium moisture protection without the need for expensive cold-form foils; avoiding use of bottles eliminates the added cost associated with gas flush/purge and a secondary packaging with sachets
  • Size reduction – avoiding use of cold-form foils allows for a smaller blister footprint, 40-60% smaller
  • Better performance – clear visibility of the tablet/capsule in the blister cavity ensures product identification