Activ-Polymer™ technology provides the ability to control small molecule transport through the polymer. This enables CSP to engineer compounds with a variety of properties – from absorbing or emitting specific molecules to enabling electronic or ionic transport.
The technology offers tremendous manufacturing flexibility. Products can be extruded, injection molded or blow molded to meet virtually any form factor requirement.
The pathways created by the interaction of these constituents allow for the controlled movement of gasses into and out of the polymer. This enables us to engineer compounds that absorb or transmit gas molecules into the atmosphere of the package to help maintain an optimal environment.