About Lance Miller

This author has not yet filled in any details.
So far Lance Miller has created 14 blog entries.

Live Webinar: Combating Harmful Moisture & Gas in Packaging Headspace: Next Generation Integrated Active Packaging Solutions

October 4th, 2017|Uncategorized|

CSP Technologies to sponsor upcoming live webinar presented by Healthcare Packaging on Wednesday, October 18th from 1:00 p.m. - 2:00 p.m. CDT. Tune in live [...]

Comments Off on Live Webinar: Combating Harmful Moisture & Gas in Packaging Headspace: Next Generation Integrated Active Packaging Solutions

CSP Technologies, Inc. Expanding Auburn, AL Facility for Increased Manufacturing & Warehousing Space

August 30th, 2017|Uncategorized|

Additional 110,000 Sq. Ft. also to be utilized for product development and secondary operations such as filling and assembly Auburn, AL – CSP Technologies, Inc. [...]

Comments Off on CSP Technologies, Inc. Expanding Auburn, AL Facility for Increased Manufacturing & Warehousing Space

At Smart Packaging Conference in Germany, CSP Technologies, Inc. to Present Approach for Enhancing Shelf Life for Transdermal & Oral Solid Dose Drugs

August 17th, 2017|Uncategorized|

François Bidet, Director of Business Development EMEA, CSP Technologies, to Discuss Benefits of Company’s Patented Engineered Activ-Polymer™ technology and Activ-Film™ materials for Headspace Management Auburn, AL [...]

Comments Off on At Smart Packaging Conference in Germany, CSP Technologies, Inc. to Present Approach for Enhancing Shelf Life for Transdermal & Oral Solid Dose Drugs

At IPA’s Stability Program Conference, CSP Technologies, Inc. to Present Approach for Enhancing Shelf Life for Transdermal & Oral Solid Dose Drugs

April 24th, 2017|Uncategorized|

Craig Voellmicke, VP of Business Development, to Discuss Benefits of CSP’s Patented Engineered Activ-Polymer™ Solutions for Headspace Management at June Conference in Montreal Auburn, AL [...]

Comments Off on At IPA’s Stability Program Conference, CSP Technologies, Inc. to Present Approach for Enhancing Shelf Life for Transdermal & Oral Solid Dose Drugs

At INTERPHEX NYC, CSP Technologies, Inc. to Showcase Expanded Options for Activ-Seal™ Closures with Desiccant Technology

March 1st, 2017|Uncategorized|

Built Directly into Screw Cap Closure, Effortless Insertion Technology Controls Levels of Moisture and Volatile Off-Gasses, Helping to Ensure Product Stability and Extend Shelf Life [...]

Comments Off on At INTERPHEX NYC, CSP Technologies, Inc. to Showcase Expanded Options for Activ-Seal™ Closures with Desiccant Technology

Medicine Maker Innovation Awards Recipient – Activ-Blister™ solutions

January 6th, 2017|Uncategorized|

Activ-Blister™ solutions, a packaging solution to control the internal atmosphere of existing individual blister cavities, receives #6 placing in the Top 10 in the annual [...]

Comments Off on Medicine Maker Innovation Awards Recipient – Activ-Blister™ solutions

CSP Technologies, Inc. Develops Pharmapuck™ Scavenging Devices, an Integrated Solution for Oral Solid Dose Products

October 4th, 2016|Uncategorized|

New Technology Can be Integrated into Nearly Any Container to Control Levels of Moisture & Oxygen Absorption, and Counteract Release of Odors & Scents Auburn, [...]

Comments Off on CSP Technologies, Inc. Develops Pharmapuck™ Scavenging Devices, an Integrated Solution for Oral Solid Dose Products

PHARMA/OTC

May 30th, 2016|Homepage Feature|

Leading pharmaceutical manufacturers rely on CSP to provide customized packaging solutions that securely protect products. CSP has a wide range of regulatory-compliant solutions that ensure product stability, extend shelf life, enhance brand awareness, and improve consumer experiences.

Comments Off on PHARMA/OTC

DIAGNOSTICS

May 30th, 2016|Homepage Feature|

CSP Technologies has extensive experience providing packaging solutions that ensure product stability in applications ranging from diagnostic test strip dispensers to coagulation and cardiac function testing systems.

Comments Off on DIAGNOSTICS

INDUSTRIAL

May 30th, 2016|Homepage Feature|

CSP Technologies’ expertise in multi-shot molding techniques and packaging solutions offers customers numerous options to protect sensitive electric components from environmental damage, extending product life.

Comments Off on INDUSTRIAL
Load More Posts

* These fields are required.

Please enter your email address to download these files:

Cancel

Processing...